Perbedaan antara pasta solder suhu tinggi dan pasta solder suhu rendah

Secara umum, pasta solder suhu tinggi umumnya terdiri dari timah, perak, tembaga dan elemen logam lainnya, dan titik leleh konvensional di atas 217 derajat. Dalam pemrosesan chip LED, keandalan pasta solder bebas-suhu tinggi-tebal relatif tinggi, dan tidak mudah untuk disolder dan retak.

Titik leleh pasta solder suhu rendah-konvensional adalah 138 derajat . Ketika komponen tambalan tidak dapat menahan suhu 200 derajat atau lebih dan proses reflow tambalan diperlukan, pasta solder suhu rendah-harus digunakan untuk proses pengelasan. Itu tidak dapat menahan penyolderan aliran ulang suhu tinggi-dari yang asli dan PCB. Komposisi paduannya adalah paduan timah bismut. Suhu puncak penyolderan reflow dari pasta solder suhu rendah adalah 170-200 derajat.

Pasta solder suhu tinggi:

1. Ini memiliki kinerja pencetakan rolling dan tin yang baik, dan juga dapat menyelesaikan pencetakan yang akurat untuk bantalan dengan jarak serendah 0.3mm.

2. Several hours after the solder paste is printed, it still maintains its original shape without collapse, and the patch elements will not be offset.

3. It can meet the requirements of different grades of welding equipment, does not need to complete welding in nitrogen filled environment, and can still show good welding performance in a wide range of reflow furnace temperature.

4. The residue of high-temperature solder paste after welding is very little, colorless, has high insulation resistance, will not corrode PCB, and can meet the requirements of no cleaning.

5. It can be used in paste in hole process.

Pasta solder suhu rendah:

1. Excellent printability, eliminating omission, depression and fast knot in the printing process.

2. Good wettability, bright, uniform and full solder joints.

3. Suitable for wide process and fast printing.

4. Fully comply with ROHS standards.

       High temperature solder paste is suitable for high temperature welding components and PCB; Low temperature solder paste is suitable for components or PCBs that cannot withstand high temperature welding, such as heatsink module soldering, led soldering, high frequency welding and so on.

     The alloy composition of high temperature solder paste is generally tin, silver and copper (SAC for short); The alloy composition of low-temperature solder paste is generally Sn Bi series, including various alloy components such as SnBi, snbiag and snbicu. Sn42bi58 is a eutectic alloy with a melting point of 138 degree , and other alloy components have no eutectic point and different melting points.